Bolts Tech

The four stages

DesignEngineers describe the circuit in code and verify it in software.
FabricationA fab builds the circuit on silicon wafers layer by layer.
TestEach chip on the wafer is checked; faulty ones are marked.
PackagingGood chips are cut out, mounted and sealed so they can connect to a board.

Design

Chip designers write a description of the circuit in a hardware description language, simulate it, and turn it into a physical layout of billions of transistors. They use specialised electronic design automation (EDA) software and often license ready-made building blocks, called IP cores, from other companies. A common example is a processor core licensed from Arm.

Fabrication

Fabrication happens in a fab, a factory with extremely clean air. Circuits are built on round silicon wafers through hundreds of steps: depositing thin films, patterning them with light through a photomask (lithography), etching away material and adding impurities to change how the silicon conducts. The most advanced fabs use extreme ultraviolet (EUV) lithography machines, which come from a very small number of suppliers.

A single wafer holds many chips. The share that work correctly is called the yield. Improving yield on a new process is one of the hardest and most valuable things a fab does.

Testing and packaging

After fabrication, wafers are tested, cut into individual dies and packaged. The package protects the die and connects it to the circuit board. Advanced packaging now places several dies side by side or stacked, linked by very fine connections. That lets a company combine a processor with high-bandwidth memory in one package, and it has become a bottleneck of its own. Some packaging is done by foundries; much is done by specialist assembly and test companies.

Fabless, foundry and IDM

ModelDesigns chipsManufactures chipsExamples
FablessYesNo, uses a foundryNVIDIA, and Apple for its own chips
Pure-play foundryNo (builds customers' designs)YesTSMC
Integrated device manufacturer (IDM)YesYes, mostly in its own fabsIntel, Samsung Electronics

The lines blur. Some IDMs also offer foundry services to outside customers, and some also use outside foundries for part of their range.

Samsung Electronics shows how one company can sit in several boxes at once: it designs and builds its own memory chips, makes chips for outside customers as a foundry, and buys some components from rivals for its phones.

Why this matters when you read the news

  • A shortage of fab capacity or packaging can hold back chip designers who have plenty of demand.
  • New fabs take years to build and equip, so supply responds slowly.
  • Export rules can target design software, manufacturing equipment or finished chips separately.

Terms used here are defined in the glossary.